- Industry: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
Those tests performed in assembly after the seal operation in order to confirm the quality of the device assembly. Testing would normally include such screens as stabilization bake, constant acceleration, temperature cycle, and hermeticity testing.
Industry:Semiconductors
A monocrystalline layer of material deposited onto a substrate in such a manner that the layer being formed has the same crystal orientation as the substrate material. (Often referred to as "epi".)
Industry:Semiconductors
A memory device whose content can be established through a programming process (usually hot electron injection) and can be totally erased by exposure to ultraviolet light for sustained periods (typically 30 minutes). When properly erased, the device can be reprogrammed.
Industry:Semiconductors
An alloy of two or more metals with the lowest melting point that is possible from any combination of those metals. The melting point of the eutectic will normally be lower than the melting point of either metal in its pure state.
Industry:Semiconductors
One of the final steps in processing a wafer during which conductive metal, usually aluminum, is deposited on the surface of the wafer in order to provide electrical interconnection of the various active elements on each die. Metallization may also be accomplished through sputtering.
Industry:Semiconductors
A post-mortem examination of failed devices for the purpose of verifying the reported failure and identifying the mode or mechanism of failure. Failure analysis techniques may range from simple electrical and/or visual examination to some of the more advanced techniques of physics, metallurgy, and chemistry.
Industry:Semiconductors
The calculated rate at which device failures will occur within a total device population (normally expressed in terms of percent per thousand hours or devices per 106 unit hours).
Industry:Semiconductors
A feature (normally associated with built-in test) that allows identification of a malfunctioning subcircuit or circuits within a complex device.
Industry:Semiconductors
The smallest controllable dimension on the surface of a die, usually determined by minimum line width.
Industry:Semiconductors
